Welcome to In-Mat Die Attach Adhesive

    Die Attach Adhesive

Non-Conductive Die Attach Adhesive
Product Description
TE1009

Single component, snap cure die attach epoxy designed for small to medium die size. This product is non-conductive version of IMT-EE1009.

TE1009-2K

Two components version of TE1009.

TE1020

Single component, oven cure die attach epoxy designed for small to medium die size. This product has excellent adhesion strength to various lead frames & substrates.

TE1020-1

Lower viscosity version of TE1020.

TE1040

Single component, low temperature snap cure die attach epoxy. This product is non-conductive version of EE1040.

Conductive Die Attach Adhesive
Product Description
EE1009

Single component, snap cure die attach epoxy designed for small to medium die size. This product has low ionic contents & excellent electrical properties.

EE1009-2K

Two components version of EE1009.

EE1019

Single component, fast cure die attach epoxy designed for small to medium die-size. This product has good adhesion to various lead frames, substrates & flex tape.

EE1040

Single component, low temperature snap cure die attach epoxy. This product has high glass transition temperature and suitable for small to medium die size application. It has ultra low ionic contents.

EE1040-HV Higher viscosity version of EE1040. The material rheology is developed for automatic screen printing equipment. 
EE1052-8 Single component, moderate temperature cure conductive die attach adhesive. This product is designed for medium die size semiconductor and microelectronic applications.