Welcome to In-Mat Liquid Encapsulant


    Liquid Encapsulant


Globtop / Fill Material
ProductDescription
CE06-3 BLK

Single component, fast cure encapsulant epoxy designed for COB/COF. It has an excellent pot life of three months at room temperature.

CE06-3TB BLK

Single component, fast cure encapsulant epoxy designed for COB. This product has high viscosity & formulated for high gloss appearance. It has an excellent pot life of more than three months at room temperature. Not recommended for fill material.

CE06-3WB BLK Lower viscosity version of CE06-3TB BLK.
CE06-TM BLKSingle component, fast cure encapsulant epoxy designed for COB/COF. It has a long pot life of more than one month at room temperature.
CE06-S BLK Single component, low temperature cure encapsulant epoxy material. This product is designed to cure at 70deg Celsius on rigid and flexible substrates.
Dam Material
Product Description
CE06-3WB-HV BLK Higher viscosity version of CE06-3WB BLK. This product is designed as a dam material for COB/COF.

CE06-HV BLK

High viscosity and thixotropic version of CE06-TM BLK. This product is formulated as a dam material for COB/COF.

Underfill Material
ProductDescription
CE07 RW

Single component, unfilled flexible epoxy formulated as a reworkable BGA/CSP flow underfill. This underfill exhibits high flow properties when heated.

Potting/Casting Material
ProductDescription
CE04-10 Two components, clear & transparent potting epoxy designed for LED applications. This product is non-yellowing, non-toxic, non-corrosive and RoHS compliant.
CE04-11

Two components, clear & transparent epoxy designed for general potting/casting applications. This product is crystal clear after room temperature cure overnight.

CE04-3 BLK

Two components potting/casting black epoxy for industrial applications. This product is designed for room temperature cure overnight. It offers good chemical resistance and has a low viscosity.

CE04-3 WHITE White color version of CE04-3 BLK.
CE04FR BLK

Two components, fire resistant potting/casting black epoxy for electronic applications. This product is UL94-V0 approved, low temperature curable and has a long pot life. It possesses very low viscosity for ease in degassing and self-leveling.

CE04-3FR RED

Two components, fire resistant potting/casting epoxy for industrial applications. This product is designed to meet UL94-V0 flammability testing requirement. It is room or low temperature curable.

CE05-9 Two components, flexible potting/casting epoxy designed for low stress application. This product is room or low temperature curable.
UV Light Cure Material
ProductDescription
UVT6431

Single component, uv cure encapsulant epoxy designed as fill material for COB/COF. Recommended to use together with UVT6434 dam material.

UVT6434

Single component, uv cure encapsulant epoxy designed as dam material for COB/COF. Recommended to use together with UVT6431 fill material.

UVT6601

Single component, uv/thermal dual cure encapsulant epoxy designed as globtop material for COB/COF. UV-A + hot-plate or oven cure.