Welcome to In-Mat Application Specific Adhesives


    Other Applications


General Adhesive
ProductDescription
CE04-3

Two components general epoxy adhesive designed for room or low temperature cure. This product has low viscosity for good flow properties. It offers excellent adhesion strength to various metals, plastics & glass.

CE08-2

Two components general epoxy adhesive designed for room or low temperature cure. This medium viscosity epoxy possess excellent chemical resistance, flexibility as well as low toxicity.

B-Stage Adhesive
ProductDescription
TE1100B

Single component, thermally conductive B-stage epoxy. This product is developed for heat-sink application and possesses high thermal conductivity properties compared to standard inorganic filled epoxy.

TE1100B-UF Unfilled version of TE1100B. This product is well suited for automated, high speed dispensing.
SMT Adhesive
ProductDescription
SA109

Single component, low temperature and fast cure SMT epoxy adhesive. This product is designed for screen printing application. It has an excellent heat resistance and offers high adhesion strength.

SA110-2

Single component, low temperature and fast cure SMT epoxy adhesive. This product is designed for dispensing application. It has an excellent heat resistance and offers high adhesion strength.

Structural Adhesive / Material
ProductDescription
CE08F

Two components, unfilled epoxy adhesive formulated for general industrial applications. This high viscosity epoxy is designed for room or low temperature cure. It has good adhesion strength to metals, plastic, rubber materials and woods.

Fiber-Optics Adhesive
ProductDescription
CE33-2K

Two components, moderate to high temperature cure, unfilled epoxy adhesive. This product is designed to bond fiber-optics, metals, ceramic and plastics. It has a long pot life of more than 24 hours. Available in premixed or syringe packing.

Non-Conductive Adhesive (NCA)
Product Description
CE07-1

Single component, snap cure NCA designed as a no-flow underfill for small die flip-chip application. This product has an excellent adhesion property to rigid substrate and flexible tape.

SA110-3

Single component, snap cure NCA designed for die attach of COB. This product has an excellent adhesion property to gold surface and PCB.

 
UV Light Cure Adhesive
ProductDescription
UV6000 Single component, UV-A light cure epoxy adhesive designed for bonding of heat sensitive electronic components. This product has an excellent adhesion property to various metals, PCB, glass, ceramic and plastics.
Epoxy Ink
ProductDescription
CE-09 BLK

Single component, unfilled epoxy designed for clear & transparent coating applications. This product has high heat resistance and good adhesion strength to various metals.